Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 3 settimane. Ho sostenuto un colloquio presso Apple (Washington, DC) nel mese di dic 2016
Colloquio
Interviewed with two teams. One focused on the technical and the other focused on resume. Hiring process is pretty direct and fast. Recruiters are very responsive and well-mannered. Interview was interesting and straight to the points. A little brain teaser might be kicked in too
Domande di colloquio [1]
Domanda 1
Thermodynamics and basic manufacturing/materials science question.
The interview went well overall. The interviewer opened with a discussion about a project I'm proud of, then a beam scenario question that covered structural and load analysis, stress and deflection, and material selection — testing my ability to connect first-principles thinking across the full problem space.
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Apple (Cupertino, CA) nel mese di apr 2026
Colloquio
Interview with hiring manager then virtual onsite. They ask you general mechanical engineering questions as well as questions dependent on type of team and skills they are looking for. Not bad overall just brush up on basic beam deflection, GD&T, Design analysis etc.
They gave me a take home tolerance analysis worksheet. It was essentially a tolerance stack up for one of their products and felt fairly straight forward. Thought I answered it well but ultimately they decided to move forward with other candidates.