Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 3 settimane. Ho sostenuto un colloquio presso Apple (Durham, NC)
Colloquio
Initial "informal chat" that was actually an interview on campus. Asked a mix of technical questions (stress/strain diagram, necking, etc) and design questions based on an example in my resume (they asked me to redesign a project I'd worked on based on fake client feedback). And a brain teaser. Some discussion about finite element analysis work that I'd done after my freshman year and some in-depth questions on how FEA works.
Second interview was 30m phone interview with 2 hardware engineers. I expected technical questions but got none. The interview was all about how my design process works, and was rather ambiguous.
Domande di colloquio [1]
Domanda 1
Advantages/disadvantages of tetrahedron and hexagonal FEA elements.
Ho sostenuto un colloquio presso Apple (Sunnyvale, CA)
Colloquio
Screening, followed by onsite. At least 4-5 hours of interview sessions. Diagramming on white board. Questions on digital design and signal integrity. Tough. Detailed. Also questions on experience and culture fit.
Domande di colloquio [1]
Domanda 1
Where should you place the capacitor on a power pin?
Ho sostenuto un colloquio presso Apple (Bengaluru)
Colloquio
It was 3 stage process with technical, hr, culture fit round and they asked medium problems with covering basics of the circuits design, digital electronics. And they also gone through cv and asked situation questions
Recruiter reached out and first conversation
Then first and second round of 45 min technical interview. The technical interview need critical thinking and have a fresh mind of all fundamentals of electronics