Ho presentato la mia candidatura tramite un selezionatore. La procedura ha richiesto 4 mesi. Ho sostenuto un colloquio presso Apple (Boulder, CO) nel mese di nov 2022
Colloquio
Everyone I spoke to was very smart and kind, they purposefully ask questions they don't expect you to have answers to in order to judge how you think through problems. Only complaint was the timeline, interviewed for 4 months starting with a 30 minute technical interview then 6 hr product design challenge plus 1 hr presentation of design challenge and ended with 5 hrs of 30min interviews with people from different teams.
Domande di colloquio [1]
Domanda 1
You have two metal spheres that look and feel exactly the same from the outside but are made from different metals - describe non-destructive methods to determine what the materials are.
Ho sostenuto un colloquio presso Apple (Shenzhen, Guangdong)
Colloquio
i had my interview today and was asked the same question. also similarly, the interviewer had no sense of humor. it was not a enjoyable experience because i think i gave like 3-4 different ways of making a cantilever, but i was asked "what else?" like 10 times for the cantilever problem alone. i also have 7 years of work experience, but there was 0 question asked about it.
Domande di colloquio [1]
Domanda 1
What causes corrosion, and how do you design to mitigate it?
The interview went well overall. The interviewer opened with a discussion about a project I'm proud of, then a beam scenario question that covered structural and load analysis, stress and deflection, and material selection — testing my ability to connect first-principles thinking across the full problem space.
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Apple (Cupertino, CA) nel mese di apr 2026
Colloquio
Interview with hiring manager then virtual onsite. They ask you general mechanical engineering questions as well as questions dependent on type of team and skills they are looking for. Not bad overall just brush up on basic beam deflection, GD&T, Design analysis etc.