Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 2 giorni. Ho sostenuto un colloquio presso HCLTech (Poona) nel mese di gen 2019
Colloquio
I want to say that interview process is quite simple first round it is a written test in returns race they ask basically three sections first one is a core question second one is a mathematical ENTC questions third third one is quantitative question questions second thing is there is a technical round as ENTC engineer they asked me Korean 30 equations and third round is a HR round basically it is for terms and condition like pain in India job Rio location and 24 by 7 work
Domande di colloquio [1]
Domanda 1
in interview they ask about difference between Fet and BJT asked about project and uses of project questions about D flip flop SR flip flop JK flip flop sensors actuators and their performance
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso HCLTech (Chennai)
Colloquio
I was asked questions from my favorite subjects, and based on that, I was further questioned.
I was first asked questions from my favorite subjects, and then they asked follow-up questions.
They questioned me starting from my favorite subjects and then moved to deeper questions.
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso HCLTech
Colloquio
First will be technical round and second will be HR round. Technical round will be based on basic electronics engineering. Need to prepare all from basic according to resume. Questions are based on OpAmp, FET, DC-DC Converters etc.
Ho sostenuto un colloquio presso HCLTech (Dublino, Dublino)
Colloquio
First call is just a screening with the recruiter and he will ask about your salary expectations, time to define or decline, depends on your expectations. After that, probably you will have one or two technical interviews with the project managers.