Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso HP Inc. (Bengaluru) nel mese di nov 2017
Colloquio
1)first round was aptitute(20 questions)+technical(22)+java/c++(8)
2)the interviewer was quite friendly and asked about my background,the projects i did in my engg course. He was quite happy with my performance.
3)HR round-The Hr was the worst person i have ever met in my life. He was so rude and didn't ask proper questions.
In the end they hired students who didn't even expect to be there. The process was very screwed. HP inc let me down.
The round: First interview over the phone. The second round: Second interview in person with two people - many difficult questions. Followed by a Visit of the offices, which was open space.
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso HP Inc.
Colloquio
Asking for general question and ask for what you talk about. Will ask from resume. Feel very chill and friendly in the interview. Interview is around 1 hrs and physical
Ho presentato la mia candidatura online. La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso HP Inc.
Colloquio
The interview process was relatively straightforward. After applying for the internship role, I received a call for a short interview with HR before going for an interview with the hiring manager.
Domande di colloquio [1]
Domanda 1
Could you introduce yourself and why you are interested in HP
