Ho presentato la mia candidatura online. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso HP Inc. (Burnaby, BC) nel mese di giu 2023
Colloquio
1 hour with light discussion and leetcode easy question, fairly straightforward and everyone involved was very patient and nice, mostly a get to know you and maybe half an hour of coding
It was behavioral, mainly, talking about my experiences inside and outside of school. This involved talking about projects and being a bit technical about that. This was after I set up the interview with the recruiter.
Domande di colloquio [1]
Domanda 1
Tell me one time you worked with a team on a project.
Ho sostenuto un colloquio presso HP Inc. (Cambridge, East of England, England)
Colloquio
I had a single round interview | mostly Q/A and discussion on works I might be expected to take part in, quick practical assessment on ideology over a product workflow | overall interview took about 40 minutes.
Domande di colloquio [1]
Domanda 1
Questions on previous work experience and skillsets.
Ho presentato la mia candidatura online. La procedura ha richiesto 2 mesi. Ho sostenuto un colloquio presso HP Inc. (Taipei) nel mese di feb 2025
Colloquio
There're three stage of the interview,
First is virtual onsite group interview with 5 candicate,
if passed the first stage, you'll need to move to onsite interview with your team leader in Taipei.
Third stage is about interviewing with hiring manager.
Domande di colloquio [1]
Domanda 1
Describe a experience of failure? How you conquer it?
