La procedura ha richiesto 3 mesi. Ho sostenuto un colloquio presso HP Inc. (Kuala Lumpur)
Colloquio
The HR are friendly and not stressful during the interview section. Overall, the interview section is considered good. I am going to give you an 8/10. Good pay as an intern trainee.
The round: First interview over the phone. The second round: Second interview in person with two people - many difficult questions. Followed by a Visit of the offices, which was open space.
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso HP Inc.
Colloquio
Asking for general question and ask for what you talk about. Will ask from resume. Feel very chill and friendly in the interview. Interview is around 1 hrs and physical
Ho presentato la mia candidatura online. La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso HP Inc.
Colloquio
The interview process was relatively straightforward. After applying for the internship role, I received a call for a short interview with HR before going for an interview with the hiring manager.
Domande di colloquio [1]
Domanda 1
Could you introduce yourself and why you are interested in HP
