Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Honeywell (Hyderabad) nel mese di ott 2021
Colloquio
Applied through campus. It consist of 3 rounds.
Round 1: 3 Coding Questions
Q1: Related to strings
Q2: Related to arrays
Q3: Tough question. Related to strings
Round 2: Technical Round
I am from EEE. So they asked questions on embedded related. Interviewer also asked OOPS concepts also. I cleared technical round.
Round 3: HR round
Domande di colloquio [1]
Domanda 1
Technical Round:
1) what are unions?
2) Difference between union and structure
3) What is bool?
4) Types of data types?
5) difference between local, global variables and asked about memory storage?
6) Asked to Implement Inheritance program and also asked advantages?
Ho sostenuto un colloquio presso Honeywell (Atlanta, GA)
Colloquio
Recruiter call (45 mins) and main round met with 3 people and talked. One leetcode medium, behavioral, and one system design. Overall process was smooth and would not worry to much just make sure you study.
Domande di colloquio [1]
Domanda 1
Resume experience plus explaining good and bad about each internship I had.
1 hour in-person interview. They asked a lot of behavioral questions about past experiences and projects that I had done. Contacted me after I applied to a job through a college career fair.
Domande di colloquio [1]
Domanda 1
Describe a time when a project didn't go the way you planned.
Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso Honeywell nel mese di nov 2025
Colloquio
Interview was smooth. Asked questions from dot net core, web api, entity framework. Good knowledge on topics. Technical discussion. Oops concepts. Linq, Angular, frame works. Security on dotnet return types of web api
