1st round was technical and held in college campus followed by a telephonic HR round. There was a sudden technical round after that (telephonic). The whole interview process went on for 2-3 weeks
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso Honeywell (Manipal) nel mese di ago 2011
Colloquio
3 rounds of interviews. first was a written test where they asked basic mechanical engineering questions
next hr where they asked behavioral questions
and finally had an interview with a project lead
Domande di colloquio [1]
Domanda 1
How did you deal with a difficult person you've had to work with?
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Honeywell
Colloquio
The hiring committee will seek for a committed person most importantly. Should show some maturity and confidence while speaking with the interviewer. Be frank and use facts while answering the questions.
