Ho presentato la mia candidatura online. La procedura ha richiesto una settimana. Ho sostenuto un colloquio presso Meta (Palo Alto, CA) nel mese di nov 2010
Colloquio
The first round of the interview is by a HR. She asked me some basic question of data structure and algorithms. And then she asked me to solve the puzzle whose difficulty is more than "meal".
I solved the puzzle in the weekend and send back her mail, and then she arranged an engineer to give a technical interview in the next week.
The technical interview is made up of three questions and all of them are about coding.
The first two are not that difficult, and easy to get the solution.
The last one is some difficult.
I get a declined mail in the next Monday after the interview :(
Domande di colloquio [1]
Domanda 1
Delete the node with the associated key in the linked list.
Ho presentato la mia candidatura tramite segnalazione di un dipendente. Ho sostenuto un colloquio presso Meta
Colloquio
I was invited to take their OA about a week after applying, mostly consisted of leetcode easy and mediums. It was a pretty smooth process, with quick feedback. Good experience overall
Domande di colloquio [1]
Domanda 1
Data structures and algorithms, leetcode style medium and easy
Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso Meta
Colloquio
They ask the normal standard DSA questions that you would expect for an internship like LeetCode mediums. I think there were two rounds of technical interviews before the offer stage.
Ho sostenuto un colloquio presso Meta (Londra, Inghilterra)
Colloquio
DS&A questions, interview is just that with only a couple mins of non technical. Need to be quick and fluent in standard leetcode easy-med, and have decent enough grasp to come up with good ideas to approach leetcode hards.
Domande di colloquio [1]
Domanda 1
DS&A. Asked about how to merge 3 ordered array into ordered array. Then, how to generalise for k ordered arrays. Was okay, but need to be faster and have solution down as if you can do it in your sleep.