Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso Amphenol (Danbury, CT) nel mese di ott 2009
Colloquio
My initial interview was as an intern. Initial communication came from the HR. They called and asked if I'd like an on-site interview. I accepted and the interview was about 5-6 one on one interviews. They usually do a tour of the factory, but we did not have time for that. After the interviews, I heard back through a phone call that I had been hired as an intern. After the internship they offered me a full time job. This time the process was informal. Only had one interview with HR.
Four rounds 1st hr basic details 2ndtechnical interview with manager-previous work, gd&t, 3rd engineering head and final hr, Design related questions, modeling, selection of materials, strength of material basics Question related to the details provided on resume
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Amphenol (Sidney, NY)
Colloquio
I was contacted by phone then selected for an in-person interview in Sidney, NY facility. Interviewed consisted of meeting with four two man groups of each department seeking an intern, plus a meeting with the hiring manager. Questions were often the same between each group with a few differences given the group.
Domande di colloquio [1]
Domanda 1
If we were to ask one of your professors or previous employers what would they say was your greatest weakness?