Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Apple (Ann Arbor, MI) nel mese di gen 2017
Colloquio
I applied through university recruiting, and I interviewed in the UMich. The interviewer first asked me questions about stress-strain curve, basic dynamics, and beam bending. Then went to more open-ended questions described below.
Domande di colloquio [1]
Domanda 1
How will you drill a hole on a cylinder? Give me 5 ways.
I received an invitation for an internship opportunity, which I was genuinely excited about because the company seems like a great place to work and grow professionally. After I replied, however, I did not hear back, which was a little disappointing. The communication process could definitely have been better, but my overall impression of the company remains very positive. It still looks like an excellent workplace, and I would be happy to have the chance to join the team in the future.
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Apple
Colloquio
45 min screening round. asked general questions about the physical design process including basics like setup/hold. asked me to draw circuits and basic digital design concepts. wasn't too difficult but they ghosted me
Resume based shortlist and interview of 2 rounds core concept based questions only no dsa i only attended round 1 didnt shortlist for round 2 it was easy but my interviewer were asking situation based questions