Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso Corning nel mese di lug 2018
Colloquio
I had two calls with their R&D engineers, both projects related to FPGAs. One of the senior guys said that he wanted to print me on board to work on a new FPGA project for their testing equipment.