Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 3 giorni. Ho sostenuto un colloquio presso Happen Bank nel mese di feb 2016
Colloquio
I handed my resume to a Lending Club recruiter at my school's career fair. I was contacted by a recruiter two weeks later to tell me about internship opportunities and see if I would be interested. Afterwards, she set up a Skype interview with an engineering director for an hour. Everyone was extremely nice and I thoroughly enjoyed my interview conversation! Later the same day, I got a phone call offering me the internship.
Domande di colloquio [1]
Domanda 1
asked about OOP, unit testing (concepts & hypothetical scenarios etc)
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 3 settimane. Ho sostenuto un colloquio presso Happen Bank (San Francisco, CA)
Colloquio
overall good experience. 4 1:1 interviews with different managers/employees within the company. recruiter was helpful and responsive only until you get rejected. had to reach out to find out i was rejected.
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 3 mesi. Ho sostenuto un colloquio presso Happen Bank (Champaign, IL)
Colloquio
Submit CV at a career fair
Got email to schedule in 2 weeks
Got the screen phone call in 2 months (it is rescheduled once)
Got the call on time, and we talked about 30 mins
Got an email informing me not being selected
End