Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 2 giorni. Ho sostenuto un colloquio presso Wipro (Adilābād) nel mese di set 2016
Colloquio
Interview Process consists of 3 rounds
1)Written Test
It consists of Aptitude both Verbal,Quant,Analytical, Techincal.
For toppers having 8.3 cgpa or above there is no Quant,Analytical test. They have to write only Technical Aptitude.
2)Technical Interview
This round is not that much tough. Basic questions on Programming lang, Puzzles, Sorting, Swapping etc. About resume.
3)HR round
Simple round. Asked about interests, future goals, why wipro? why not other? etc
Domande di colloquio [1]
Domanda 1
Which one is better working in a group or as an Individual?
Interview was basic and easy. You can clear it with aptitude, reasoning, and programming skills. Practicing more problems on HackerRank will help you solve challenges effectively with consistent practice daily.
It’s good with basic technical questions . Question are from resume and previous experience .
Question are about project and some technical question to related to resume .
Be prepare for the ur resume and common concepts in respective language
Ho sostenuto un colloquio presso Wipro (Hyderabad)
Colloquio
Smooth and easy questions were asked in technical round .if you have good knowledge in what u put on your resume to will crack the interview . The technical round would be around 20-30 min