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      Colloqui di WolfspeedColloqui per Product Development Engineer II presso WolfspeedColloquio di Wolfspeed


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      Colloquio per Product Development Engineer II

      8 set 2023
      Candidato anonimo a colloquio
      Durham, NC
      Offerta rifiutata
      Esperienza positiva
      Colloquio nella media

      Candidatura

      Ho presentato la mia candidatura online. La procedura ha richiesto 2 mesi. Ho sostenuto un colloquio presso Wolfspeed (Durham, NC) nel mese di dic 2022

      Colloquio

      This experience was from Dec, 2022 Overall the interview process was pretty good except for the lack of communication from the hiring manager who was in charge of salary negotiations. A regular HR call was followed by a 30-minute phone interview with the hiring manager explaining about the company and asking a few technical questions. The final round was a panel interview with 6 different people which was exhausting and required doing a presentation of my research. The job role was primarily to do thermal analysis on their SiC chips so a lot of questions were from Thermodynamics, Heat Transfer, and Materials. I knew I was going to get the offer after my final round which I did. When I tried to negotiate the salary, the hiring manager informed me that he needed to check with his upper management to see if the salary I asked for could be approved and that he would get back to me with a final number. Instead, he didn't come back to me and scheduled interviews with other candidates, and ultimately my offer was rescinded as they found someone cheaper. Felt really sad that things like this could happen at such a reputed company. Regardless of the final outcome, be it miscommunication or budgeting issues, it felt like a great set of people to work with.

      Domande di colloquio [1]

      Domanda 1

      Fourier's law of heat conduction? Diffusivity? If you want to dissipate heat faster what kind of materials would you choose? There were a lot of heat transfer-related questions in conjunction with materials? (read about the chip manufacturing process) If two metal strips of different thermal expansion coefficients are bonded together (one on top of the other) and heated, how would the resulting shape be and which material has a higher stress concentration?
      Rispondi alla domanda
      1