Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso onsemi (Chennai) nel mese di dic 2020
Colloquio
There were three interviews, two technical rounds and one HR round
It was through campus placement.
One interview asked mostly I2C and SPI and kind of communication protocol. Other asked about previous experience.
Domande di colloquio [1]
Domanda 1
DAC conversion,
Question about the embedded system
About GPS GSM and AT command (based on my mini project)
Ho sostenuto un colloquio presso onsemi (München, Bavaria)
Colloquio
El proceso comenzo con una entrevista telefonica con un headhunter.
E segundo paso fue una entrevista via teams con el jefe del equipo donde you trabajaria.
El tercer paso fue una sere de llamadas con la gerente de recursos humanos.
Finalmente una entrevista en persona.
Domande di colloquio [1]
Domanda 1
Cuales son los aspectos mas importantes en el diseno the "power modules"?
cual es la difference en el rendimiento y comportamiento entre IGBTs y SiC MOSFETs.
Asked based on your resume so be prepared to answer your projects. The overall interview experience was good. The process was flexible for the candidate. Tech questions could be tough based on your position
Domande di colloquio [1]
Domanda 1
Talk about your project, tech difficulties and how to solve
La procedura ha richiesto 2 giorni. Ho sostenuto un colloquio presso onsemi nel mese di feb 2024
Colloquio
HR contacted and set up an interview for the next day. I went in and met up with two engineers and talked about the role about 2-3 hours followed by lunch. Another interview after that day was set up with the higher ups. Since that day, I have not been able to get a hold of HR and I got ghosted. They did not reply to my Email nor did they answer my text message to the HR lady, this is just rude.
Domande di colloquio [1]
Domanda 1
From resume. Tell me about your projects and built upon that. Op amps, ADC, Signal Integrity questions.