Ho presentato la mia candidatura tramite segnalazione di un dipendente. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso AMD nel mese di ott 2011
Colloquio
I was interview through a referral. This works the best. Not applying through company websites and consultants. If you have a contact who know the hiring manager, your chances of an interview jump multifold. Therefore building contacts is the key.
there were 4 rounds of interview with 3 technical and 1 HR. The technical stuff was all based on my resume. So people, dont boost up your resume by putting skill you are unfamiliar/unaware of. It will look ugly if they start interviewing on stuff you put in your resume which you are not familiar about. Freshers take note of this.
It was based on logic optimization puzzles, physical design questions, timing questions. Not to0 difficult.
Ho presentato la mia candidatura online. La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso AMD (Londra, Inghilterra) nel mese di gen 2026
Colloquio
1. HR call - slary expectation, relocation, general q/a
2. CV based interview with hiring manager (focusing on past relative work experinence)
3. 4 Tech interviews (problem solving, algorithms, job specific tech skills)
Domande di colloquio [1]
Domanda 1
propose a design of the module based on provided specifications
Ho sostenuto un colloquio presso AMD (Texas City, TX)
Colloquio
It was smooth, i had three rounds with first being the screening. It was for internship so they mostly focused on intermediate level C++ programming for performance architecture role. It was a video interview via teams.
Telephone and video call,
Basics to projects
Resume based
Power sta front end
Back end
Synthesis
Vlsi
What are the challenge you will see in lower technology?
What are the inputs and outputs from the power analysis?
What are the checks after power planning is completed?
What are the power dissipation components? How to reduce them
Why float outputs are ignored but not float gates?
How do you calculate the core ring width?
What is IR drop? And how will you decrease this?
Domande di colloquio [1]
Domanda 1
What are the challenge you will see in lower technology?
What are the inputs and outputs from the power analysis?
What are the checks after power planning is completed?
What are the power dissipation components? How to reduce them
Why float outputs are ignored but not float gates?
How do you calculate the core ring width?
What is IR drop? And how will you decrease this?