Got 1 phone call and virtual Interview. Is not hard on the iv as long as you have the technical repair skills especially on PC hardware and software repair knowledge.

Two interview conducted by video call. The first interview was conducted by the GM and went well. Nothing much just sharing my previous working experiences. Then he asked me to complete test 1 and test 2 and submit the test before 2nd interview. After a month, the second interview was conducted by the techinical team which located at taiwan. They tested me more on the technical part, to be specifically on the motherboard troubleshooting. The questions is not too hard if you understand about the basic circuit and troubleshooting.