Ho presentato la mia candidatura online. La procedura ha richiesto 5 giorni. Ho sostenuto un colloquio presso Altimetrik (Bengaluru) nel mese di lug 2018
Colloquio
First Round: Profile Shortlisting
Second Round: Techincal Interview with Altimetrik
Third Round: Technical Interview by Onsite Techincal Team
Fourth Round: HR Interview
As above, I cleared all the rounds. Then the Altimerik HR Team send me an informal offer letter asking all personal details.
Then they play with you based upon the requirements from Client Team. If they need fewer people then then they'll not give you offer, giving blah blah reason. I don't recommend to my friends if you've any other options./alternative then look for this company, not Altimetrik.
Domande di colloquio [1]
Domanda 1
Google Interview questions from your techincal domain, the same would be asked.
Ho presentato la mia candidatura online. La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso Altimetrik nel mese di apr 2026
Colloquio
2 technical round and 1 client round.
Very bad experience they took all the round and then said we wont move forward as we are having low budget.
Last round they told face to face with client but never happened.
Very slow process.
I think interview process could be better check candidate budget at start so that unnecessary time wont waste.
Domande di colloquio [1]
Domanda 1
Coding question, SQL questions, Put and Patch difference.
Ho sostenuto un colloquio presso Altimetrik (Poona)
Colloquio
Interview provess it was difficult ,About my project and detail about DSA, and some logical questions and also ask therotal questions. 4 technical round happend. it was good experience for me
Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso Altimetrik (Gurgaon, Haryana)
Colloquio
3 Rounds: First is technical basic question related to your work. Second, Manager round only concept and knowledge sharing. Third, Client round where all technical question was there.
It was quite good experience and I cleared all the rounds.
