First, HR reached out to me through a call, scheduling me for an initial interview with the hiring manager. Then after initial interview, final interview with the senior hiring manager. After passing two interviews, they will give you a job offer. It all happened in the span of 1 week

There were two technical rounds in the interview process. The team director participated in the first round. The interview focused more on the fabrication side and covered previous projects, experiences/jobs, software experiences, and the fundamental technical knowledge needed for the position. Second round involved a different team lead and was centered on circuit principles, equations, etc.