Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso Apple (Shanghai, Shanghai)
Colloquio
The interview process consisted of three rounds. The first round was with the lead engineer, followed by a round with another engineer. The final round involved a review of a design challenge. All rounds focused on technical skills, with no behavioral questions asked.
Ho sostenuto un colloquio presso Apple (Pittsburgh, PA)
Colloquio
Brief conversation at a networking event. Move onto second round 30 minute technical interview. Traditional technical questions as well as fundamental design questions. Mix of straightforward questions and questions that lead to more questions, i.e. how would you design this, why that material, why that manufacturing method, etc.
Domande di colloquio [1]
Domanda 1
Describe the stress strain curve of Aluminum and Steel
Friendly! Kind interviewers, repetitive questions across many teams (mostly beam bending, stress-strain). Fundamentals and basic applications of them. Friendly! Kind interviewers, repetitive questions across many teams (mostly beam bending, stress-strain). Fundamentals and basic applications of them.
Domande di colloquio [1]
Domanda 1
How would you decrease deflection of this cantilevered beam