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      Ricerche correlate: Recensioni su Apple | Offerte di lavoro di Apple | Stipendi di Apple | Benefit di Apple
      Colloqui di AppleColloqui per Product Design Engineer presso AppleColloquio di Apple


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      Colloquio per Product Design Engineer

      17 apr 2016
      Candidato anonimo a colloquio
      Cupertino, CA
      Nessuna offerta
      Esperienza positiva
      Colloquio difficile

      Candidatura

      Ho presentato la mia candidatura tramite un selezionatore. La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso Apple (Cupertino, CA)

      Colloquio

      Two Skype interviews and they flew me in for on-campus interview. The apple travel services was very convenient. Two of the interviewers had to leave on a last minute trip so I only had 6 people to interview. Almost everyone were nice and friendly, interview is very casual and comforting. People are super busy there and you can totally fell that they want to get out of this interview room and back to work. The interview goes to very basic physics questions. Don't waste your time preparing for a professional question.

      Domande di colloquio [4]

      Domanda 1

      Two Glass sheets are attached to each other using adhesive material, The combination is siting on two points of contact at both ends ( one rolling and one stationary ), We are applying a vertical force F to the center of top glass and combination deflects. How do we reduce the deflection?
      3 risposte

      Domanda 2

      We are throwing a ball into a friction-less cone, what should be the initial speed of the ball so it can orbit around the vertical axis of the cone indefinitely?
      4 risposte

      Domanda 3

      We have a cup of hot coffee and a small cold milk out of the fridge. The room temperature is in between these two. When should we add milk to coffee to get the coolest combination earliest ( at the beginning, in the middle, or at the end)?
      5 risposte

      Domanda 4

      How do you do the sampling on mass manufacturing process?
      1 risposta
      11

      Altre recensioni di colloqui per Product Design Engineer presso Apple

      Colloquio per Product Design Engineer

      10 mag 2026
      Dipendente anonimo
      Offerta accettata
      Esperienza positiva
      Colloquio difficile

      Candidatura

      Ho sostenuto un colloquio presso Apple

      Colloquio

      The interview went well overall. The interviewer opened with a discussion about a project I'm proud of, then a beam scenario question that covered structural and load analysis, stress and deflection, and material selection — testing my ability to connect first-principles thinking across the full problem space.

      Colloquio per Product Design Engineer

      19 mag 2026
      Candidato anonimo a colloquio
      Cupertino, CA
      Nessuna offerta
      Esperienza positiva
      Colloquio difficile

      Candidatura

      Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Apple (Cupertino, CA) nel mese di apr 2026

      Colloquio

      Interview with hiring manager then virtual onsite. They ask you general mechanical engineering questions as well as questions dependent on type of team and skills they are looking for. Not bad overall just brush up on basic beam deflection, GD&T, Design analysis etc.

      Domande di colloquio [1]

      Domanda 1

      Ways to reduce beam deflection
      Rispondi alla domanda

      Colloquio per Product Design Engineer

      16 mar 2026
      Candidato anonimo a colloquio
      Nessuna offerta
      Esperienza neutra
      Colloquio nella media

      Candidatura

      Ho sostenuto un colloquio presso Apple

      Colloquio

      They gave me a take home tolerance analysis worksheet. It was essentially a tolerance stack up for one of their products and felt fairly straight forward. Thought I answered it well but ultimately they decided to move forward with other candidates.

      Domande di colloquio [1]

      Domanda 1

      Describe what the max size of this component
      Rispondi alla domanda