Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso Apple (San Luis Obispo, CA) nel mese di gen 2020
Colloquio
On campus two 30 mins interview. Asked two short technical questions during the first and one long technical question during the second interview. The questions were from mechanics of material and mechanical design.
Domande di colloquio [1]
Domanda 1
Related to beam deflection - comparison between two beams and finding total deflection of a beam.
The interview process consisted of an initial recruiter screen followed by a hiring manager conversation and multiple team interviews. The process was fairly structured and straightforward, with each stage building on the previous one. The final round included several back-to-back sessions that covered portfolio deep dives, design thinking, and collaboration. Everyone I spoke with was professional, thoughtful, and asked in-depth questions that pushed on both craft and problem-solving.
Domande di colloquio [1]
Domanda 1
Tell me about a project where you had to design for multiple iterations
Ho sostenuto un colloquio presso Apple (New York, NY)
Colloquio
Interview went well nothing strange. I was impressed at the general structure of the interview. I also like the vibe of the interviewer, That's all I have to say about that.
Ho sostenuto un colloquio presso Apple (Shenzhen, Guangdong)
Colloquio
5-6 rounds of interview, design challenge, plenty of tech questions on mechanical basics. The first round was 30 min phone call, then tech interviews with managers, then a design challenge and group interview. The rest depends on team I feel like.