Ho presentato la mia candidatura online. La procedura ha richiesto 4 settimane. Ho sostenuto un colloquio presso Apple nel mese di nov 2021
Colloquio
Applied for entry level positions right out of undergrad and a recruiter hit me about this specific role which was a junior level role. Initial phone screening was standard and got scheduled for an online technical interview. Basic engineering fundamental questions and tougher problems (heat transfer and beam bending). After technical interview, you get assigned a design project to work on for a week. That's as far as I got.
Domande di colloquio [1]
Domanda 1
1. H beam and I beam bending comparison
2. Resistance modeling for heat transfer
3. 5-6 basic fundamental questions
Ho sostenuto un colloquio presso Apple (Shenzhen, Guangdong)
Colloquio
i had my interview today and was asked the same question. also similarly, the interviewer had no sense of humor. it was not a enjoyable experience because i think i gave like 3-4 different ways of making a cantilever, but i was asked "what else?" like 10 times for the cantilever problem alone. i also have 7 years of work experience, but there was 0 question asked about it.
Domande di colloquio [1]
Domanda 1
What causes corrosion, and how do you design to mitigate it?
The interview went well overall. The interviewer opened with a discussion about a project I'm proud of, then a beam scenario question that covered structural and load analysis, stress and deflection, and material selection — testing my ability to connect first-principles thinking across the full problem space.
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Apple (Cupertino, CA) nel mese di apr 2026
Colloquio
Interview with hiring manager then virtual onsite. They ask you general mechanical engineering questions as well as questions dependent on type of team and skills they are looking for. Not bad overall just brush up on basic beam deflection, GD&T, Design analysis etc.