Ho presentato la mia candidatura tramite un'altra fonte. La procedura ha richiesto 3 settimane. Ho sostenuto un colloquio presso Apple (Cupertino, CA) nel mese di ott 2022
Colloquio
The interviewers were fine - they wanted someone that can immediately get on board with the day-to-day tasks, though I was expecting more research-oriented work. But the recruiting process was very unclear that I was told it was the last round of interview and then I was asked to be interviewed again by someone else.
Domande di colloquio [1]
Domanda 1
Describe the heat transfer process of a thin plate made of aluminum-steel alloy.
Ho sostenuto un colloquio presso Apple (Cupertino, CA)
Colloquio
Technical interview consisting a 5-6 structural mechanics and FEA questions. I had several questions about what it’s like to work there but they told me they would ask the questions first. They were extremely serious the whole interview.
Domande di colloquio [1]
Domanda 1
Imagine an aluminum plate is pinned at the edges and a point load is applied in the middle. Where is the shear stress the highest