Ho presentato la mia candidatura online. La procedura ha richiesto 2 mesi. Ho sostenuto un colloquio presso Apple (Cupertino, CA)
Colloquio
Thorough process with four levels. Technical assessment/mechanical engineering problem solving interview, "take home" mechanical design problem, "take home" manufacturing design problem, and in-person interviews with 8 1-hour interviews with product design, GD&T, high-volume manufacturing best practices, etc. Very little discussion on previous work.
Domande di colloquio [1]
Domanda 1
A combination of product design and manufacturing questions were asked.
The interview went well overall. The interviewer opened with a discussion about a project I'm proud of, then a beam scenario question that covered structural and load analysis, stress and deflection, and material selection — testing my ability to connect first-principles thinking across the full problem space.
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Apple (Cupertino, CA) nel mese di apr 2026
Colloquio
Interview with hiring manager then virtual onsite. They ask you general mechanical engineering questions as well as questions dependent on type of team and skills they are looking for. Not bad overall just brush up on basic beam deflection, GD&T, Design analysis etc.
They gave me a take home tolerance analysis worksheet. It was essentially a tolerance stack up for one of their products and felt fairly straight forward. Thought I answered it well but ultimately they decided to move forward with other candidates.