Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso Apple
Colloquio
Was first contacted through email to schedule the first round of phone interview. The process was pretty smooth and the interviewer was well prepared. Then I was scheduled another round of phone interview where the interviewer didn't seemed that well prepared.
Domande di colloquio [1]
Domanda 1
Describe past experience and ask what you would have done differently given a second chance.
The interview went well overall. The interviewer opened with a discussion about a project I'm proud of, then a beam scenario question that covered structural and load analysis, stress and deflection, and material selection — testing my ability to connect first-principles thinking across the full problem space.
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Apple (Cupertino, CA) nel mese di apr 2026
Colloquio
Interview with hiring manager then virtual onsite. They ask you general mechanical engineering questions as well as questions dependent on type of team and skills they are looking for. Not bad overall just brush up on basic beam deflection, GD&T, Design analysis etc.
They gave me a take home tolerance analysis worksheet. It was essentially a tolerance stack up for one of their products and felt fairly straight forward. Thought I answered it well but ultimately they decided to move forward with other candidates.