Ho presentato la mia candidatura online. La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso Arm (Hong Kong) nel mese di feb 2015
Colloquio
The interview started with an explanation of the actual job they do in their group. After that I've been asked to talk about my master project and a lot of behavioural question came out after that. At the end the question moved to the devices scaling (mostly effect of scaling, no hints from the interviewer). On average it was a fair interview, and not getting an offer could be only my fault that I prepared too much on synthesis questions instead of physical devices.
Ho presentato la mia candidatura tramite segnalazione di un dipendente. Ho sostenuto un colloquio presso Arm (San Diego, CA) nel mese di apr 2026
Colloquio
1st was a hirevue interview - basic behavioral questions
2nd round was a panel interview - discussion on your resume and technical questions related to power and designing low power circuits
Domande di colloquio [1]
Domanda 1
Given two processors, how would you determine which is better in terms of power (think about frequency, VDD, temperature etc)
Given a boolean logic, how would you reduce power in this
CV and then virtual interview then final interview through online call. It was basic interview about CV and some technical questions. It was not too difficult and intimidating. Technical interview depends on the role you apply for.
Domande di colloquio [1]
Domanda 1
What was a difficult problem you encountered during your studies and how did you overcome it.
Interview was done online remotely with a manager and a graduate employee. General questions about previous experience and CB. Then followed by a live code session in Arm assembly with various technical questions.
