Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Autodesk (Mohali, Punjab) nel mese di mag 2026
Colloquio
On campus Autodesk generally include 4 rounds
1. OA - Mid to hard leetcode
2. Technical 1 - pattern , deep oops concept and live coding 2 ques
3. Technical 2
4. HR Round
Domande di colloquio [1]
Domanda 1
Technical Interview 1 - lowest common ancestor, diameter of tree
Ho presentato la mia candidatura online. La procedura ha richiesto 3 settimane. Ho sostenuto un colloquio presso Autodesk (Bengaluru) nel mese di set 2025
Colloquio
4 Rounds of Interview. 1st round OA, 2nd Round - Technical + Low level DSA, 3rd round - High level, 4th Round - HR. Interviewer was friendly. Questions asked from Resume and DSA Leetcoding Type - Easy and Medium Type.
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso Autodesk (Poona)
Colloquio
Faced three medium to hard coding challenges involving Graphs, Dynamic Programming, and Arrays. Each problem required effective problem solving strategies and algorithmic thinking to implement optimized solutions across distinct data structures.
