Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Autodesk (Chandigarh) nel mese di mar 2023
Colloquio
Online assessment (60 minutes) 2 DSA rounds (30 minutes each) HR round (30 minutes ) Overall interview was good i cleared first round that is online assessment. In first DSA round I was able to solve one question.
Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso Autodesk
Colloquio
- 1 technical interview: 2 hours [C++ OOP, personal projects and implementation techniques, 3D mathematics]
- 1 behavioural interview: 30 min [motivation, examples of failure]
- a couple of check-ups with the recruiter
Domande di colloquio [1]
Domanda 1
Explain and draw the object-oriented structure of a project you’ve worked on before.
Ho sostenuto un colloquio presso Autodesk (Toronto, ON)
Colloquio
The interview went smoothly. We covered my past projects and thesis, followed by technical questions regarding model training, computer vision, and LLMs. The interviewer was nice person and I liked the process.
Domande di colloquio [1]
Domanda 1
Mostly about my projects and high level concepts in ML and DL.
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso Autodesk (Bhubaneshwar) nel mese di mag 2025
Colloquio
I gave the which consist of four question two extremely easy and two extremely hard. And the time limit of 90 minutes is too less. Horrible experience. They give a package of 39 lpa which they give after 1 year of internship and performance based pre placement offers.
Le migliori aziende per "stipendio e benefit" vicino a te
