There were 3 rounds in the interview process. Round 1: The first round was taken by a lead engineer and went quite smoothly. I was a bit nervous, but he carried the conversation in a way that made it comfortable and easy to talk. Round 2: In the second round, his senior joined, and the tone shifted a bit. Although the position was for an FPGA engineer, the questions leaned more towards embedded systems knowledge. It started fine with discussions about my projects and basic FPGA/Verilog concepts, but towards the end, the tone felt unnecessarily harsh when I couldn’t answer some unexpected questions. There were remarks about my resume and college, which felt a little uncalled for and left me discouraged. round3 It was an HR round, which I was ineligible for. Overall: This round left my spirits low. I feel interviews should challenge you, but they should never break you down.