Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Caresoft (Bhopal) nel mese di ago 2023
Colloquio
Technical & Hr rounds conduct. interview process between 2 -4 weeks and interview go good and there nature is very nice with us during interview and management also very good and join this company because it's not only give us job but a career
Domande di colloquio [1]
Domanda 1
What is you strength & weekness? Why should we hire you?
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Caresoft (Bhopal) nel mese di feb 2017
Colloquio
I have been selected in Campus Drive of Caresoft Inc. I have faced 1 programming test and PI ( Technical and HR)In Programming test, they ask to make programs in either of any language(C,C++,Java). You should be aware of small mistakes in programs otherwise you will not get selected. After i was called for next round they asked 5 programs in TR which are basics programs to judge your logical ability. then they called me for Final round at Company Office. They asked me normal question related to my CV's.
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso Caresoft (Bhopal) nel mese di mag 2015
Colloquio
First there was a technical round.the questions were relatively average.Then there was a aptitude round.Questions were easy.After that there was a technical Interview round.The questions asked were from the resume.and after that was the HR round which was normal and questions were like why this job and where in 5 years.
Domande di colloquio [1]
Domanda 1
Technical Questions from the resume like mine was from cloud computing and networking.
