Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso Cyient (Hyderabad) nel mese di nov 2013
Colloquio
campus placement
package 3.5 but 3 years bond
online written exam by cocubes.com
1.written exam 2.technical round 3. HR
written exam is avg level.
technical round is about strength of matertils sfd bmd etc ... and composite materials
if u clear t.r then interview round is easy to get in..
Domande di colloquio [1]
Domanda 1
be strong in units and sfd and bmd diagrams ..u can get in easily
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 7 settimane. Ho sostenuto un colloquio presso Cyient (Hyderabad)
Colloquio
Crazy mind blown up to eat like this only one paid for the product Suddenly stops and plays the product Suddenly stops and plays the role of him in cyient mins to
Domande di colloquio [2]
Domanda 1
What's app you have to recall everything is fine with me and plays the
Ho sostenuto un colloquio presso Cyient (Hyderabad)
Colloquio
Basic Mechanical engineering questions. Design, GD&T based questions. Took less thanI had a basic mechanical engineering interview that included design and GD&T based questions. The interviewer was friendly, and the whole process took less than 15-20 minutes. Overally very easy interview. 15-20 mins. The interviewer was friendly.
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 4 settimane. Ho sostenuto un colloquio presso Cyient (Hyderabad) nel mese di dic 2023
Colloquio
The Hiring process starts with a written exam consisting of few sections such as Aptitude, English and Mechanical Engineering core fundamentals. After the written exam there will be 2 rounds. Technical and HR.
