Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 2 giorni. Ho sostenuto un colloquio presso Cyient (Hyderabad) nel mese di gen 2017
Colloquio
Written test followed by technical and HR rounds. Written test is similar to that of any other company, verbal ability, logical reasoning and basic mathematics. Technical was all about core and the role domain.
Ho presentato la mia candidatura tramite un'altra fonte. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso Cyient (Bengaluru) nel mese di mar 2020
Colloquio
Starts with an Aptitude Round consisting of almost 25-30 questions following with Technical Interview. Aptitude questions included Speed-time and distance, HCF and LCM, Simple and Compound Interest, Basic Mechanical Engineering related numericals.
Domande di colloquio [1]
Domanda 1
Difference between 1st Angle and 3rd Angle Projection.
Units of Stress, Strain, Power, Energy
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso Cyient (Hyderabad) nel mese di gen 2017
Colloquio
The Interview conducted was not fair. There were 3 panels conducting the Technical round and from the first two panels almost everyone were asked about there project and a few basic Technical questions but in the third panel where I went, they were asking industry level Technical questions. I am not saying they shouldn't but they should consider the fresher status. That was my first interview and because of those idiots, my confidence was down to complete zero and I was totally upset. And not only that first two panels had only one person per panel were as in the third panel there two senior design engineers sitting and expecting an experienced engineer right out of the college. Nobody who went into third panel were selected. But the other two panels selected 15 guys
Domande di colloquio [1]
Domanda 1
Requirements for selection procedure of a Thrust bearing ?