Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso DCP Midstream LP nel mese di feb 2018
Candidatura
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 2 mesi. Ho sostenuto un colloquio presso DCP Midstream LP
Colloquio
Applied at a university job fair. I was interview the next day and a few weeks later sent to a on-site interview. The first interview was very easy and basically just to determine if I would be willing to go to/be happy in a small rural town and if I would get along with other employees. The on-site consisted of two panel interviews where they asked more standard behavioral questions.
Got the interview after a career fair. Interview was very relaxed, I was asked about what I would bring to the company, and what I knew about DCP. After that, most of the interview was centered around my resume and talking about my achievements and future goals. Overall, very positive experience. Got an offer 2 days after interview, and 3 days after meeting at career fair.
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 5 settimane. Ho sostenuto un colloquio presso DCP Midstream LP (Denver, CO) nel mese di feb 2018
Colloquio
Met with recruiters during a school career fair, had a secondary interview after that with two DCP engineers from the local office. It took quite a while to hear back from the company, but it was due to an unforseen delay in the recruiting process.
Domande di colloquio [1]
Domanda 1
Are you comfortable with using modeling software to solve problems?