Ho presentato la mia candidatura tramite un'altra fonte. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso Detroit Engineered Products (Chennai) nel mese di apr 2018
Colloquio
I attended a walkin in April 2018, First , the written test was very easy. After qualifying d written test, technical round is carried out. Candidates from CS background were asked about FEA and those from mechanical, were asked from advanced programs like parallel programming concepts. After this,they will not respond to ur calls and will call u after 3 months for HR and Manager rounds. I heard from employees that management is very bad and doesn't pay salaries in time and salary offered is less than the profile standard.
Domande di colloquio [1]
Domanda 1
What is parallel programming and object oriented programming, give example programs for both .
Ho sostenuto un colloquio presso Detroit Engineered Products (Chennai)
Colloquio
It was a telephonic interview. Interviewer was so nice and friendly, it was about 20-30 mins of conversation. Mostly questions were related to my projects and about my internship experience. Overall it was an positive experience.
Domande di colloquio [1]
Domanda 1
Polymorphism from c++. How will you fid wheather a dot is inside or outside a polygon?
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 2 mesi. Ho sostenuto un colloquio presso Detroit Engineered Products (Chennai) nel mese di gen 2024
Colloquio
round 1 :
apptitude(related to maths trognometry and aptitude questions) and technical questions(that is mostly related to pseudocode in C++ language)
round 2;
technical interview(oops concepts and what you say in the question "introduce youself"
round 3 :
hr interview "this will be an asusual basic HR interview questions"
Domande di colloquio [1]
Domanda 1
in apptitude they will ash about maths(trignometry)
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Detroit Engineered Products
Colloquio
First round was online test(C++ and aptitude test), then technical interview. Interview was short around 20 mins. For my others friend they took two round of technical interview. Only basics questions asked. Som, thermo, geometry(12th maths, related to circle and triangle).
Domande di colloquio [1]
Domanda 1
Strength of material, thermodynamics, geometry questions