Ho sostenuto un colloquio presso Detroit Engineered Products (Chennai) nel mese di set 2021
Colloquio
I had a telephonic interview, as I am fresher most of the questions were based on my internship and projects (mostly from my resume). Interview duration was around 45mins to 1 hour.
Ho sostenuto un colloquio presso Detroit Engineered Products (Chennai)
Colloquio
It was a telephonic interview. Interviewer was so nice and friendly, it was about 20-30 mins of conversation. Mostly questions were related to my projects and about my internship experience. Overall it was an positive experience.
Domande di colloquio [1]
Domanda 1
Polymorphism from c++. How will you fid wheather a dot is inside or outside a polygon?
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 2 mesi. Ho sostenuto un colloquio presso Detroit Engineered Products (Chennai) nel mese di gen 2024
Colloquio
round 1 :
apptitude(related to maths trognometry and aptitude questions) and technical questions(that is mostly related to pseudocode in C++ language)
round 2;
technical interview(oops concepts and what you say in the question "introduce youself"
round 3 :
hr interview "this will be an asusual basic HR interview questions"
Domande di colloquio [1]
Domanda 1
in apptitude they will ash about maths(trignometry)
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Detroit Engineered Products
Colloquio
First round was online test(C++ and aptitude test), then technical interview. Interview was short around 20 mins. For my others friend they took two round of technical interview. Only basics questions asked. Som, thermo, geometry(12th maths, related to circle and triangle).
Domande di colloquio [1]
Domanda 1
Strength of material, thermodynamics, geometry questions