Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso Dolcera
Colloquio
2 rounds of technical
1 round of non-technical
the process was smooth despite the delay in sharing the feed back .
Employer likely to know the candidate interest to join in the patent field
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Dolcera (Campusa) nel mese di lug 2024
Colloquio
Interview process has three round. Two rounds were of technical and last was HR round. In first round of interview they asked about basic communication that we study in GATE and in next technical round two puzzle questions were asked.
Domande di colloquio [1]
Domanda 1
they asked about digital communication , mobile communication
Ho presentato la mia candidatura tramite un selezionatore. Ho sostenuto un colloquio presso Dolcera nel mese di lug 2023
Colloquio
First I applied on Online Job Board. First Round is Resume shortlisting and then second round is technical round. In which You to chose five topics from given topics. Topics are related to wireless communication.
Domande di colloquio [1]
Domanda 1
All questions are related to wireless Communication. In-depth knowledge of wireless Communication.