Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 4 giorni. Ho sostenuto un colloquio presso Einfochips (Ahmedabad) nel mese di ago 2020
Colloquio
I applied through campus placement. There is total 4 round.
1st round was technical and general apptitude test.
2nd round was trchnical interview 1.
3rd round was technical + managerial round.
4th was hr round.
Domande di colloquio [1]
Domanda 1
about my project,oops concept,language and scenario based questions.
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso Einfochips (Vadodara) nel mese di ott 2021
Colloquio
For there is written test after if you score good enough than hr form that company will schedule an interview of Technical round. interview was there after this interview there is hr round if selected.
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 3 giorni. Ho sostenuto un colloquio presso Einfochips (Ahmedabad) nel mese di set 2020
Colloquio
I was asked about questions about Hardware mainly. But a few of my friends got questions about software also. There were 2 technical rounds followed by an HR round. Sometimes they don't care if you know a thing or not, but they will try to explain it to you and want to see how quickly you learn.
Domande di colloquio [1]
Domanda 1
Tell me about the difference between different communication protocols like SPI, I2C, and UART.
