Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso First American Financial Corporation (Dāvangere) nel mese di ago 2022
Colloquio
The first was apti which was easy which was followed by Group Discussion further more it was followed by 2 technical round and HR interview the technical round was not soo difficult and at the same point not soo easy it 1at technical round was basic and they concentrated more on data structures, oop, and DBMS and there was two coding questions to solve and 2nd technical round was purely coding round as it was an on campus for me the recruiters came to our campus and I tried my level best to write the code on sheet and it was precise and I got placed to First American company.
Ho sostenuto un colloquio presso First American Financial Corporation
Colloquio
It was very good and all the interviewers were great and smmoth process. Satisfied with the job. But the process was late and went till late night. But a very good company to work for.
Domande di colloquio [1]
Domanda 1
About software and language learnt and ability to learn.
Ho presentato la mia candidatura tramite l'università. Ho sostenuto un colloquio presso First American Financial Corporation
Colloquio
Interview process was good happened on campus,there was an aptitude followed by group discussion,then interview happened , you are supposed to be good at basics and they asked simple questions .In the end they didn't select anyone from college they said they were looking for something more in students