Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 2 giorni. Ho sostenuto un colloquio presso HARMAN (Vellore) nel mese di set 2019
Colloquio
Harman International came to our Campus for Placement.
1st Round: 160 people were shortlisted for this round. Online Coding and Technical Round on Elitmus with Offline Aptitude and Problem Solving Round.
2nd Round: 90 people were shortlisted for this round. F2F Technical Round where they asked about Multiplexers and CMOS, Multithreading, one DP question, about page replacement algorithms, normalisation. Questions were of average strength.
3rd Round: HR Round! Round was easy. Basic questions about company and technologies I have worked on.
Domande di colloquio [1]
Domanda 1
Given a binary matrix, find out the maximum size square sub-matrix with all 1s.
it was good
The interview process typically involves a series of steps designed to assess a candidate’s qualifications, experience, and fit for a role. While it can vary by company and position, here’s a standard breakdown:
Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso HARMAN
Colloquio
The interview process was very smooth.
The level ranges from easy to medium.
Basic question were asked. Interviewer was very calm and gave enough time for explaining the answers and communication was two way
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto una settimana. Ho sostenuto un colloquio presso HARMAN (Bengaluru) nel mese di gen 2025
Colloquio
interivew process consist of three round
round 1:onilne assessment
it consists of 55 questions based on oops,one coding question,verbal,quantitative,logical reasoning,dbms questions
round 2:techincal interview
interviewer ask about the projects mentioned in resume and skills
round 3:hr and mangerial round
checks for soft skills
