Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso HCLTech (Chennai) nel mese di nov 2016
Colloquio
to the point, not very lengthy. I was recruited through campus placement, so not many rounds of discussion. pay offered was lesser in comparison with other companies that have come for recruitment on the same day
The interview process is fairly extensive and typically consists of around 6–7 interview rounds. The entire process is structured to be completed within approximately one week, allowing the team to assess candidates thoroughly across different stages.
Total of three rounds. First round with HR and Second with the Hirning manager. Post that document verification and then offer letter is rolled out. Quick process with sometimes take mutiple people for sample profile from bschools togther like typical IT companies.
Domande di colloquio [1]
Domanda 1
Statred with intro, then about MBA and projects along with why HCL
Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto 2 giorni. Ho sostenuto un colloquio presso HCLTech (Samaya NO 2) nel mese di ott 2022
Colloquio
Introduction of all four panels, followed by my introduction, and internship experience, followed by two ase study questions. Further I was asked how comfortable I would be with US shift timings
Domande di colloquio [1]
Domanda 1
Q1 case study and use cases questions Q2 Internship based questions Q3 Would you be ok to work according to US timings?