Ho presentato la mia candidatura tramite l'università. La procedura ha richiesto un giorno. Ho sostenuto un colloquio presso HCLTech (Nuova Delhi) nel mese di lug 2019
Colloquio
First round is written. As I attended for storage engineering domain , there were two sets of questions
1) pure c programming
2) C and network .
First round was little bit difficult . They asked about the subnets, subnet masking and some C programs. Somehow I cleared the First round.
Second round was technical interview . HR asked me from my area of interest . He asked from the basics . As I prepared earlier , I can easily clear the technical interview .
Third round was general HR round. They just conducted it for formality . Students who cleared technical interview is directly selected and placed .
Hope this helps you !! All the best !
Domande di colloquio [1]
Domanda 1
what is modulation and demodulation ?
tell about transport layer ?
difference between TCP and UDP ?
why UDP is unreliable ?
how will you make UDP reliable ?
thumb rule for modulation ?
some basic questions in digital electronics about combinational and sequential circuits , flip flops
Ho presentato la mia candidatura tramite un selezionatore. La procedura ha richiesto 2 giorni. Ho sostenuto un colloquio presso HCLTech (Albany, NY) nel mese di mag 2014
Colloquio
Interview process was short. within one week after contacted y recruiter I was scheduled for phone screening. With next week I was ask to report at primary place of assignment
Domande di colloquio [1]
Domanda 1
Ask relevant questions related to the position and past experience