Ho presentato la mia candidatura tramite un'altra fonte. La procedura ha richiesto 5 settimane. Ho sostenuto un colloquio presso HCLTech (Noida) nel mese di giu 2017
Colloquio
there were 3 rounds including - telephonic, f2f and HR round. f2f was the main and lengthy one. Once the F2f is cleared is just the negotiations which left. telephonic was short and simple
Domande di colloquio [1]
Domanda 1
Mostly related with cloud provider AWS. There was some question related to networking
Ho presentato la mia candidatura tramite un'altra fonte. Ho sostenuto un colloquio presso HCLTech (Chennai)
Colloquio
Initial screening technical interview and HR round it is an easy process when you really have some level of technical skills and based on the interview panel you can easily clear your interviews.
Please try to negotiate salary before joining
Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso HCLTech (Ho Chi Minh) nel mese di ago 2024
Colloquio
My interview for Technical Specialist is very fast. It's take around 30' to finish the session. But the questions is really realistic and stay with the technical things. Around 4 technical question and 2 situation question. And then we talk about benefit and etc
Domande di colloquio [1]
Domanda 1
What you will do when user bring their laptop and with bluescreen.
The process was moderate with client round also completed before receiving the offer letter. Overall it was good experience as the questions were mostly on my current role and challenges faced recently in the current project in my previous company