Ho sostenuto un colloquio presso HERE Technologies (Mumbai)
Colloquio
Four round interview process at HERE Technologies for an ML Engineer R&D role. Round 1 covered ML and GenAI depth, Round 2 focused on data engineering and AWS, and Round 3 involved senior Data Scientists assessing research thinking, project depth, and problem solving approach.
Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso HERE Technologies (Mumbai) nel mese di mag 2024
Colloquio
First I get the call on my cellphone it was mostly technical 30in interview then I received an assesement after that scheduled another technical Interview. It was only and only research based deep knowledge on Data science domain.
Ho presentato la mia candidatura tramite un'agenzia di reclutamento personale. Ho sostenuto un colloquio presso HERE Technologies nel mese di gen 2024
Colloquio
I got call for this in Jan 2024. First round was with a panel of 4 members where each person discuss around 15 to 20 min. First person started asking questions on scenario based ML question [usually the problem statement mentioned in resume]. Second person asked questions realted to basic ml, cv, nlp. Further there was a coding round where they ask me to clean data and come up with a solution. Finally third person asked questions related to mlops.
Domande di colloquio [1]
Domanda 1
1. vanishing and exploding gradients in cnn
2. how does google maps work and how do we create a new map using satellite images using AI
