Four round interview process at HERE Technologies for an ML Engineer R&D role. Round 1 covered ML and GenAI depth, Round 2 focused on data engineering and AWS, and Round 3 involved senior Data Scientists assessing research thinking, project depth, and problem solving approach.

First I get the call on my cellphone it was mostly technical 30in interview then I received an assesement after that scheduled another technical Interview. It was only and only research based deep knowledge on Data science domain.

I got call for this in Jan 2024. First round was with a panel of 4 members where each person discuss around 15 to 20 min. First person started asking questions on scenario based ML question [usually the problem statement mentioned in resume]. Second person asked questions realted to basic ml, cv, nlp. Further there was a coding round where they ask me to clean data and come up with a solution. Finally third person asked questions related to mlops.