Ho presentato la mia candidatura online. Ho sostenuto un colloquio presso HP Inc. (Sant Cugat del Vallès) nel mese di giu 2022
Colloquio
Tough and long process, a lot of refresh from college courses is required. On top of hard skills, problem solving and creativity are a must. The face to face interview with the manager is determing.
Domande di colloquio [1]
Domanda 1
Questions about mechanical design, heat transfer, concept design,...
Proceso de selección y dos entrevistas online o presencial. Las dos entrevistas de media hora y con una parte en inglés para valorar el nivel del idioma. La duración del proceso fueron unas semanas.
Ho presentato la mia candidatura online. La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso HP Inc. (Singapore) nel mese di ott 2024
Colloquio
2 Stages, 1st with HR and 2nd with the Engineering Team.
HR will ask questions that are more related to getting to know you, your personality, and your soft skills.
Engineering Team will ask more technical questions.
Ho presentato la mia candidatura tramite un'altra fonte. La procedura ha richiesto più di una settimana. Ho sostenuto un colloquio presso HP Inc. (Bengaluru) nel mese di set 2024
Colloquio
Recruiter will ask questions based on Resume.They focus mainly on skill section in your resume. They will ask random questions onComputer fundamentals,Data Structures and Algorithms and OOPs. In my college there are 3 round of selection.
Domande di colloquio [1]
Domanda 1
My domain and degree is on Machine Learning.They asked in depth about it
