Ho presentato la mia candidatura online. La procedura ha richiesto 2 settimane. Ho sostenuto un colloquio presso HP Inc. (Tuas) nel mese di giu 2013
Colloquio
There are 2 rounds of interview. First interview is with the hiring manager and the product engineer team lead. The second round of interview is with the managers from other departments.
Hard to understand what the interviewer was saying as he had a very heavy accent. Job description mentioned 0-1 year of experience required but doesn't seem like it according to the technical questions they ask
Ho presentato la mia candidatura tramite segnalazione di un dipendente. La procedura ha richiesto 4 settimane. Ho sostenuto un colloquio presso HP Inc. (Singapore) nel mese di set 2021
Colloquio
4 rounds, 1 call HR, 1 call peer, 1 round peer f2f, 1 round f2f with managers
All quite chill, each f2f interview had 3 people so could be quite intimidating at the start but they were all very friendly
Domande di colloquio [1]
Domanda 1
Asked about my FYP / design work and to explain what i did
Ho presentato la mia candidatura online. La procedura ha richiesto 4 settimane. Ho sostenuto un colloquio presso HP Inc. (Singapore) nel mese di feb 2019
Colloquio
Online application, then phone Interview, followed by a face to face interview. Interviewers asked a lot of questions and focused on both analytical and soft skills. Seems like they do not always hire graduates for this position. They were generally very nice, but also critical.
