Ho presentato la mia candidatura tramite segnalazione di un dipendente. La procedura ha richiesto 4 settimane. Ho sostenuto un colloquio presso HP Inc. (Sant Cugat del Vallès) nel mese di nov 2017
Colloquio
Entrevista telefónica. Al cabo de una semana, día completo de entrevistas presenciales y técnicas con diferentes miembros del equipo y con manager. Entrevista con Recursos Humanos a nivel soft. Cada bloque duraba aproximadamente 1 hora. Incluía comida en la cantina.
Domande di colloquio [1]
Domanda 1
Termodinámica, transferencia de calor, diseño mecánico, mecánica de fluidos
Hard to understand what the interviewer was saying as he had a very heavy accent. Job description mentioned 0-1 year of experience required but doesn't seem like it according to the technical questions they ask
Ho presentato la mia candidatura tramite segnalazione di un dipendente. La procedura ha richiesto 4 settimane. Ho sostenuto un colloquio presso HP Inc. (Singapore) nel mese di set 2021
Colloquio
4 rounds, 1 call HR, 1 call peer, 1 round peer f2f, 1 round f2f with managers
All quite chill, each f2f interview had 3 people so could be quite intimidating at the start but they were all very friendly
Domande di colloquio [1]
Domanda 1
Asked about my FYP / design work and to explain what i did
Ho presentato la mia candidatura online. La procedura ha richiesto 4 settimane. Ho sostenuto un colloquio presso HP Inc. (Singapore) nel mese di feb 2019
Colloquio
Online application, then phone Interview, followed by a face to face interview. Interviewers asked a lot of questions and focused on both analytical and soft skills. Seems like they do not always hire graduates for this position. They were generally very nice, but also critical.
